Osama Tobail

Citation:

Zimmermann, M., J. N. Burghartz, W. Appel, N. Remmers, C. Burwick, R. Wurz, O. Tobail, M. Schubert, G. Palfinger, and J. Werner, "A seamless ultra-thin chip fabrication and assembly process", Electron Devices Meeting, 2006. IEDM'06. International: IEEE, pp. 1–3, 2006.

Abstract:

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Notes:

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